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Wireless equipment InvenSense InvenSense Inc. has secured $19 million in Series C venture capital financing. The Sunnyvale, Calif., company is a provider of motion sensing technology for mobile consumer applications. The round was led by new investor Sierra Ventures of Menlo Park, Calif., with participation from previous investors Artiman Ventures of Palo Alto, Calif., Partech International of San Francisco and Qualcomm Ventures of San Diego, as well as strategic investors Foxconn, Inventec Appliances Corp., both of Taiwan; Skylake Ventures from South Korea; Japan's DoCoMo Capital; and VentureTech Alliance Partners LLC of San Jose, Calif. Ben Yu, managing director at Sierra Ventures, will join InvenSense's board of directors. The round brings InvenSense's total funding to $38 million. The proceeds will be used to expand sales operations and for product development. InvenSense is developing technology for integrated motion-sensing in consumer electronics, with a focus on gaming and mobile handsets and for use in applications such as image stabilization, mobile navigation, location-based services and smart-user interfaces that use hand motion and gesture-based commands. Internet Jobster Social networking employment site Jobster has raised $7 million in venture capital. The Seattle company has received $55 million overall. The capital comes from return backers Ignition Partners of Bellevue, Wash., Mayfield and Trinity Ventures, both of Menlo Park, Calif., and Reed Elsevier Ventures of New York. Software Verdiem Seattle-based Verdiem Corp., a developer of power-management software for PC networks, has raised $12 million to enhance its sales and marketing efforts. The company has raised a total of $27 million in total capital. The insider round was led by insider NCD Investors, joined by Kleiner Perkins Caufield & Byers of Menlo Park, Calif., Catamount Ventures of San Francisco and Phoenix Partners of Seattle. The company says its technology reduces energy consumption by a PC by over 30%. Energy Xunlight Thin-film solar material developer Xunlight Corp. has raised $22 million in a Series B round to move into full production mode. The Toledo, Ohio, company landed Trident Capital of Palo Alto, Calif., as lead investor, joining Emerald Technology Ventures AG of Zurich and NGP Energy Technology Partners of Washington, which backed the company's $7 million first round in July. The new round is earmarked for completing construction of a plant using proprietary process technology to manufacture flexible, thin-film amorphous silicon solar modules. Amorphous silicon is a noncrystalline form of the material often used in photovoltaics.
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